Understand the LED lamp bead packaging production process

The first step is to select the appropriate LED chip packaging, considering factors such as size, luminous efficiency, color, voltage, and current. Below are the key points for description:

1. Crystal Expansion: Using an expansion machine, the entire sheet of LED wafer film provided by the manufacturer is uniformly expanded to separate the closely arranged LED chips adhering to the film surface, facilitating the picking process.
2. Backing adhesive: Place the expanded crystal ring with the expanded crystal on the backing adhesive machine surface that has already been coated with silver paste, and apply the silver paste to the back. Apply silver paste in dots. Suitable for loose LED chips. Use a dispensing machine to apply an appropriate amount of silver paste onto the PCB printed circuit board.
3. Chip Fixation: Place the expanded crystal ring with the prepared silver paste into the chip mounting fixture, and have the operator use a chip mounter to attach the LED chip onto the PCB printed circuit board under a microscope.
4. Crystal Setting: Place the PCB printed circuit board with affixed crystals into a thermal cycle oven and maintain a constant temperature for a period of time. Remove the board after the silver paste has cured (do not leave for too long, as the LED chip coating may discolor due to oxidation, making wire bonding difficult). If the LED chip bonding is required, the above steps are necessary; if only IC chip bonding is needed, the above steps can be omitted.
5. Wire Bonding: The aluminum wire bonding machine is used to bridge the die with the corresponding pads on the PCB, which is the internal lead bonding of COB.
6. Preliminary testing: Use specialized testing tools (different equipment for COB based on various applications, with a simple setup being a high-precision regulated power supply) to inspect COB boards, and rework any defective boards.
7. Dispensing: Using a dispensing machine, apply an appropriate amount of the mixed AB adhesive to the bonded LED chips, while ICs are encapsulated with black adhesive. Subsequently, perform the final appearance encapsulation according to customer requirements.
8. Curing: Place the PCB printed circuit board or lamp base with sealed adhesive into a thermal cycling oven for constant temperature static treatment. Different drying times can be set according to requirements.
9. Final Testing: Conduct electrical performance tests on the encapsulated PCB printed circuit boards or lamp frames using specialized testing tools to distinguish between good and defective units.
10. Spectral Separation: Use a spectrometer to separate lights of varying brightness according to requirements, then pack them separately.
11. After warehousing, the LED beads will be mass-produced and distributed to create a comfortable and energy-saving lighting life for everyone.